Oak Wilt Fungus Agar

Intended Use

Oak Wilt Fungus Agar is used for cultivation of Oak Wilt fungus.

Composition**

Final pH (at 25°C): 5.7±0.2

**Formula adjusted, standardized to suit performance parameters

Directions

Suspend 50 grams in 1000 ml distilled water. Heat to boiling to dissolve the medium completely. Dispense as desired and sterilize by autoclaving at 15 lbs pressure (121°) for 15 minutes.

Principle And Interpretation

Oak wilt is a lethal fungal disease that occurs due to fungal growth in water conducting vessels (xylem) of red, live and white oak tree families.

Oak Wilt Fungus Agar is a modification of the media developed by Gallway and Bergers (1) and used for cultivation of oak wilt fungus. Oak wilt is caused by a fungus, Ceratocystis fagacearum. After infection by this fungus, the trees contract oak wilt and die and the oak wilt fungus forms fungal mats under the bark of these dead trees.

Oak Wilt Fungus Agar supports good growth of Ceratocystis fagacearum. Malt extract provides an acidic environment and nutrients required for metabolism of the fungus. Mycological peptone assists luxuriant growth of the fungus with typical morphology and pigmentation. Oxgall restricts spreading of fungal colonies. The acidic pH of the medium favours the growth of fungus.

Quality Control

Appearance: Cream to yellow homogeneous free flowing powder

Gelling: Firm, comparable with 1.5% Agar gel

Colour and Clarity of Prepared medium: Yellow coloured clear to slightly opalescent gel without any precipitate forms in Petri plates

Reaction: Reaction of 5.0% w/v aqueous solution at 25°C. pH : 5.7±0.2

pH: 5.50-5.90

Cultural Response: M669: Cultural characteristics observed after an incubation at 25-30°C after 48-72 hours.

Key: Formerly known as Aspergillus niger

Storage and Shelf Life

Store below 30°C in tightly closed container and the prepared medium at 2 - 8°C. Use before expiry date on the label.

Reference

1. Gallway L. D. and Burgers R., 1952, Applied Mycology and Bacteriology; 3rd Ed., Leronard Hill., London pg. 54 and 57.